 
		    
			| Serial number | project | unit | Laser Cutting | |
| 1. | Maximum processing size of glass | mm | 2440x3660 | |
| 2. | Single-blade processing glass thickness | mm | ≤19 | |
| 3. | Glass laser cutting speed | m/min | 7-25 (depending on glass thickness) | |
| 4. | Processing laser wavelength | nm | 1064 | |
| 5. | Processing laser power | W | 80W@20KHz@Burst5 | |
| 6. | Repetition frequency | KHz | 20-40 | |
| 7. | Pulse Energy | mJ | 4 | |
| 8. | Number of pulses | 5-6 | ||
| 9. | Power stability | < 0.5%@24 hours , rms | ||
| 10. | Laser pulse width | ps | ~15 | |
| 11. | Beam quality | M²≤ 1.3 | ||
| 12. | Operating humidity | <60%RH@25 ℃ | ||
| 13. | Cooling method | Water Cooling | ||
| 14. | Split laser type | Carbon dioxide laser | ||
| 15. | CO2 Laser wavelength | 10.6 um | ||
| 16. | C02 Laser power | 300W | ||
| 17. | Glass laser splitting comprehensive speed | m/min | 6-18 (depending on glass thickness) | |
| 18. | 
 
 
 
 Environmental resistance | Storage temperature | ℃ | 20 ~ 35 | 
| 19. | Operating temperature | ℃ | twenty two ~ 30 | |
| 20. | Ambient humidity | < 60 % | ||
| twenty one. | dust | mg/m³ | < 0.20 | |
| twenty two. | Oil mist | Not allowed | ||
| twenty three. | Electromagnetic environment | International secondary standard | ||
 
                 
 




